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Production capacity and process improvement

Production capacity and process improvement

  • Categories:Company News
  • Author:
  • Origin:
  • Time of issue:2020-09-11 17:25
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(Summary description)At present, the long-term upgrade requirements of the 5G mobile phone chip process technology force the PCB line width and line spacing to be further reduced, the upgrade of internal functional modules takes up more space

Production capacity and process improvement

(Summary description)At present, the long-term upgrade requirements of the 5G mobile phone chip process technology force the PCB line width and line spacing to be further reduced, the upgrade of internal functional modules takes up more space

  • Categories:Company News
  • Author:
  • Origin:
  • Time of issue:2020-09-11 17:25
  • Views:
Information

At present, the long-term upgrade requirements of the 5G mobile phone chip process technology force the PCB line width and line spacing to be further reduced, the upgrade of internal functional modules takes up more space, the signal transmission requirements increase, and the 5G mobile phone chip, signal, and integration requirements have increased. For high-level HDI requirements, the penetration rate of AnyLayer motherboards in the Android system will definitely increase. HDI motherboards are upgraded in technology and materials. As 5G chips have higher requirements for the motherboard’s line width, line spacing and aperture size, the following are high-frequency plates Reference table:

95

At the same time, the application of 5G also puts forward higher and more stringent requirements on the technical indicators of PCB products in terms of frequency, speed, integration, heat dissipation, and multilayer. The new Mitsubishi is added, using carbon monoxide, nitrogen, helium, The carbon dioxide is converted into a laser by a vibrator to process micro-holes (0.1mm) on the surface of the board to increase the production capacity by 2700 square meters.


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