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Process Capability

Process Capability
NO.	Item	Process capability parameters
1	Number of layers	2-32 layers
2	Maximum processing area	600x800mm
3	Minimum board thickness (by number of layers)	0.6mm/4 layer
4	Alignment between layers	4mil
5	Minimum line width/spacing (inner layer)-line width/line spacing data should be provided according to the inner copper thickness	3/3mil(1OZ)
6	Minimum line width/spacing (outer layer)-line width/line spacing data should be provided according to the copper thickness of the outer layer	3/3mil(1OZ)
7	Minimum aperture (mechanical drilli	≥0.15mm(6mil)
8	Minimum aperture (laser drilling)	0.1mm
9	HDI maximum order	HDI third-order arbitrary interconnection
10	Hole wall copper thickness	30UM
11	Metallized aperture tolerance	±3mil
12	Non-metalized aperture tolerance	±2mil
13	Hole position tolerance	3mil
14	Thickness range of resin plug hole	0.2-0.6mm
15	Resin plug hole diameter range:	0.2~0.8mm
16	Plate thickness aperture ratio	13:1
17	Minimum distance from hole to conductor (mechanical drilling)	6.5mil
18	Minimum distance from hole to conductor (laser drilling)	6mil
19	Minimum diameter of BGA pad	8mil
20	Overall dimension tolerance	±0.1mm
21	Minimum green oil bridge width	3mil
22	Minimum green oil bridge width	Single side 1mil
23	The minimum distance of the outer line of the gong without exposed copper	8mil
24	The minimum distance of the inner line of the gong without copper exposed	8mil
25	The minimum distance between the copper-free surface pad and the outer frame of the board	8mil
26	Minimum distance of ring without copper exposed	8mil
27	Plate bending	0.50%
28	Surface treatment method	OSP, ENIG, HASL, gold finger, ENEPIG, selective, gold plating, nickel palladium gold
29	Fastest delivery (4 floors/6-8 floors/10 floors above)	2 days/3 days/4 days
30	Impedance tolerance	±5%