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Can holes be punched on the BGA pads of the circuit board? How are vias handled?
- Categories:FAQ
- Author:
- Origin:
- Time of issue:2020-09-14 11:39
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(Summary description)Via holes can be punched. All BGA pads have via holes. Electroplating filling or resin plugging process must be used for normal patch use. This design is called hole in disk, and the cost of hole in disk process will increase appropriately.
Can holes be punched on the BGA pads of the circuit board? How are vias handled?
(Summary description)Via holes can be punched. All BGA pads have via holes. Electroplating filling or resin plugging process must be used for normal patch use. This design is called hole in disk, and the cost of hole in disk process will increase appropriately.
- Categories:FAQ
- Author:
- Origin:
- Time of issue:2020-09-14 11:39
- Views:
Via holes can be punched. All BGA pads have via holes. Electroplating filling or resin plugging process must be used for normal patch use. This design is called hole in disk, and the cost of hole in disk process will increase appropriately.
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