• Categories:FAQ
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• Time of issue:2020-09-14 11:41
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(Summary description)The purpose of the gold immersion process is to deposit a nickel-gold coating with stable color, good brightness, flat coating, and good solderability on the surface of the printed circuit board. Basically, it can be divided into four stages: pre-treatment (degreasing, micro-etching, activation, post-dipping), immersion of nickel, immersion of gold, post-treatment (washing waste gold, washing with DI water, drying). When you need to make a button board or connect a socket, you may need to sink gold, which is not easy to rust and has low contact resistance.