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What is Immersion Gold? Under what circumstances do you need heavy gold?
- Categories:FAQ
- Author:
- Origin:
- Time of issue:2020-09-14 11:41
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(Summary description)The purpose of the gold immersion process is to deposit a nickel-gold coating with stable color, good brightness, flat coating, and good solderability on the surface of the printed circuit board. Basically, it can be divided into four stages: pre-treatment (degreasing, micro-etching, activation, post-dipping), immersion of nickel, immersion of gold, post-treatment (washing waste gold, washing with DI water, drying). When you need to make a button board or connect a socket, you may need to sink gold, which is not easy to rust and has low contact resistance.
What is Immersion Gold? Under what circumstances do you need heavy gold?
(Summary description)The purpose of the gold immersion process is to deposit a nickel-gold coating with stable color, good brightness, flat coating, and good solderability on the surface of the printed circuit board. Basically, it can be divided into four stages: pre-treatment (degreasing, micro-etching, activation, post-dipping), immersion of nickel, immersion of gold, post-treatment (washing waste gold, washing with DI water, drying). When you need to make a button board or connect a socket, you may need to sink gold, which is not easy to rust and has low contact resistance.
- Categories:FAQ
- Author:
- Origin:
- Time of issue:2020-09-14 11:41
- Views:
The purpose of the gold immersion process is to deposit a nickel-gold coating with stable color, good brightness, flat coating, and good solderability on the surface of the printed circuit board. Basically, it can be divided into four stages: pre-treatment (degreasing, micro-etching, activation, post-dipping), immersion of nickel, immersion of gold, post-treatment (washing waste gold, washing with DI water, drying). When you need to make a button board or connect a socket, you may need to sink gold, which is not easy to rust and has low contact resistance.
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